Machine parts maker Hisaka to raise $15 mln in Singapore IPO
SINGAPORE, April 28 - Singapore-based Hisaka Holdings, which makes machine components for the semiconductor and data storage industries, plans to raise around S$20.7 million in its Singapore listing.
The firm, which has factories in Singapore, Malaysia and China, is offering 90 million shares at S$0.23 each.
Provenance Capital Pte Ltd is the issue manager and UOB Kay Hian is the underwriter and placement agent for Hisaka's initial public offering.
Saturday, May 3, 2008
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